| 摘要 |
<p>A multilayer substrate (18) has two ceramic plates (111, 114) and a shielding metal layer (113) provided between the ceramic plates. An electronic circuit having a TRIAC (7) and a photocoupler (5) is provided on the multilayer substrate. The shielding metal layer and a second main electrode (T2) of the TRIAC are connected with each other by solder filled in a through hole 116. External noise is captured by the shielding metal layer, to be propagated to the second main electrode.</p> |
