| 摘要 |
PURPOSE:To reduce permittivity, to enhance volumetric intrinsic resistance, to be adapted for a multilayered structure and high density mounting by forming the title substrate of an insulating material having many fine holes, and setting the porosity of the material at 25-70 vol.%. CONSTITUTION:A substrate is formed of an insulating material having many fine holes 2 and the porosity of the material is set at 25-70 vol.%. The mean diameter of the hole 2 is 3-30mum, and glass 4 or resin 3 is filled near the surface of the substrate 1 of the holes 2 or all the holes 2. Since such a porosity is provided, it becomes of low permittivity, hard to generate a floating capacity, rapid signal transmission speed, and high volumetric intrinsic resistance. Thus, the substrate adapted for a multilayered structure and a high density can be obtained.
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