| 摘要 |
PURPOSE:To possibly suppress oxidation of air at the surface of metal mold and prevent contamination of metal mold due to adhesion of various additives in the resin composition to the surface thereof by molding resin under the inactive gas ambience and reduced pressure. CONSTITUTION:For the formation of semiconductor sealing resin, resin is formed under the inactive gas ambience and reduced pressure. As a means for molding semiconductor sealing resin, any means may be introduced so long as it is capable of molding a thermosetting resin. However, the transfer molding using multiplunger transfer molding apparatus, injection molding or compressed molding means may usually be employed. Thereby, since the molding condition is maintained under the inactive gas ambience and reduced pressure condition even when the resin composition is exposed to high temperature at the metal mold surface during the molding process, it is possibly suppressed that various additives in the resin composition are oxidized by the air with the oxygen in the air at the surface of metal mold and thereby contamination of metal mold can be prevented. |
