| 摘要 |
PURPOSE:To mount switching semiconductor elements with good reliability under the state suitable for high frequency operation, large current operation and high breakdown strength, by electrically connecting the semiconductor elements, wiring parts on a base post and conductor parts on a circuit board one another, and making the interconnecting distances shortest when the semiconductor elements are connected in series and in parallel. CONSTITUTION:A polygonal base post 13 comprising a material characterized by electrical insulation and high thermal conductivity is fixed to a circuit board 11 having conductor paths 12. Semiconductor elements 16 are mounted on wiring parts 14, which are provided on the side surfaces of the base post 13. The semiconductor elements 16, the wiring parts 14 on the base post 13 and the conductor paths 12 on the circuit board 11 are electrically connected to one another. Therefore, the connecting length becomes short when the parts are connected in series and in parallel in the inside. A large current can be made to flow. Breakdown strength is high. The series and parallel circuits can be readily realized. A semiconductor module, which can perform high frequency operation and has excellent heat radiating property, can be obtained.
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