发明名称 CHIP CARRIER
摘要 PURPOSE:To make the positioning of a photodetector for a laser chip accurate, to facilitate the positioning work and to improve working efficiency, by mounting the photodetector on a conductor layer on one surface of a block, and providing leads, which are electrically connected to the conductor layers on the surface of the block and can be bent and deformed. CONSTITUTION:Two conductor layers 6 and 7 are provided from one side surface to the upper surface of a block 2 comprising ceramics in a rectangular parallelopiped structure. A photodetector 9 is mounted on one conductor layer 6 on one side surface. The upper electrode of the photodetector 9 and the end part of the other conductor layer 7 on the one side surface are electrically connected with a piece of wire 11. Leads 12 and 13, which can be bent and deformed, are attached to a pair of the conductor layers 6 and 7 on the upper side of the block. Therefore, when a chip carrier is fixed in a package, positioning and assembling can be performed by grasping the block 2 of the chip carrier or the leads 12 and 13, the positioning of the photodetector 9 becomes accurate, the working becomes easy and the working efficiency is improved.
申请公布号 JPS63208279(A) 申请公布日期 1988.08.29
申请号 JP19870040326 申请日期 1987.02.25
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 ITO KIYOSHI;YASUDA YOICHI
分类号 H01L31/02;H01L33/62;H01S5/00 主分类号 H01L31/02
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