| 摘要 |
PURPOSE:To prevent the fluctuation of signals such as constant potential signals, by providing a plurality of bonding pads having the same functions on a semiconductor pellet, positioning the pads in the vicinities of the mutually facing sides of the semiconductor pellet, and electrically connecting the pads in the package, without especially increasing the width of a wiring. CONSTITUTION:Bonding pads 5 and 5' having the same functions are provided on a semiconductor pellet 2. The bonding pads 5 and 5' having the same function are positioned in the vicinities of mutually facing sides of a semiconductor pellet 2. Conductor parts 3 and 3' of a package 1, which are connected to the bonding pads 5 and 5' having the same function, are electrically connected in the package 1. Since the two conductor parts 3 and 3' at the grounding potential are provided in the package, the bonding pads 5 and 5' can be provided in the vicinities of the mutually facing sides. Thus the fluctuation of the grounding potential can be suppressed without especially increasing the width of an aluminum wiring 7 provided on the pellet.
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