| 摘要 |
PURPOSE:To increase the number of electrodes per unit packaging area, by providing a plurality of staircase parts, and providing the electrodes for external connections at the respective staircase parts. CONSTITUTION:A double-layer structure comprises an upper layer and a lower layer. Electrodes 11 and 12 are provided at the respective staircase parts of the two layers, i.e., at the four sides of the upper side surface of the lower layer and at the four sides of opposite surface of the upper layer with respect to the lower layer. In this way, a package for semiconductor device is constituted so that a plurality of the staircase parts having the electrodes 11 and 12 for outer connection are provided. Therefore, the number of the electrodes per unit packaging area becomes many, and the packaging area is reduced.
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