| 摘要 |
PURPOSE:To enhance reliability in connection, appearance and performance after surface mounting, by cutting the tips of outer leads from an outer frame before solder plating in a lead frame, and depositing a solder plated film on the entire surface mounting part of each outer lead. CONSTITUTION:Outer leads 5 are separated from an outer frame 7 before solder plating. A solder plated film is formed on the entire mounting part of each outer lead 5 in a solder plating step. Since the solder plating is applied on the entire surface mounting part of each outer lead 5, the solder material is sucked up to the mounting part of each outer lead 5 and uniformly attached to the entire body. Therefore decrease in reliability of connection and appearance after mounting can be suppressed.
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