| 摘要 |
PURPOSE:To improve the leading-out precision of electrodes and to form numbers of external electrodes of a chip-shaped piezoelectric resonator by adhering insulating plate base material to a piezoelectric substrate base material, and then carrying out a plating treatment and forming plating films at adhesion parts. CONSTITUTION:The insulating plate base materials 55 and 57 are adhered to main surfaces 51a and 51b of the piezoelectric substrate base material 51 with adhesives respectively. Then, the piezoelectric substrate base material and insulating plate base materials 55 and 57 are cut along lines l1, l1- running in the centers of circular holes 53, 53- among plating resist films 54, 54- to form thin long-sized units 58. This long-sized unit 58 is provided with a plating layer (not shown in a figure) by carrying out electroless plating after a pretreatment such as etching, and performing a plating treatment in a charge plating vessel. The unit 58 is cut along lines l2, l2- which run in the centers of said circular holes 53, 53- and cross those plating resist films 54, 54- almost at right angles and dipped in solder to obtain chip-shaped filters. |
