| 摘要 |
<p>PURPOSE:To fix a solder material easily to a head section in accurate quantity by a method wherein metallic plating having at least a sealing effect is executed to a wire rod, the plated wire rod is cut in predetermined length size, the solder material is contact-bonded and fastened at one end section of the wire rod and the head section is formed. CONSTITUTION:Metallic plating 3 having a sealing effect and the functional effect of foundation plating for the finishing plating of gold, silver, tin, etc., is executed to a wire rod 2 for shaping a terminal. A formed plating wire rod 2A is cut in prescribed length size. A head section 6 is shaped at one end section of a cut wire rod 2B while a solder material 7 is contact-bonded and fixed to the head section 6 simultaneously. The wire rod 2B cut in predetermined length size is set to a mold in the head-section forming process 5 while the solder material 7 is positioned to the upper section of the wire rod 2B, and pressure of 140kg/mm<2> or more is applied, thus forming the head section 6 and a terminal 8 in which the solder material 7 is contact-bonded and fastened to the head section 6. Accordingly, conductivity and sealing properties are improved, and the solder material 7 can easily be fixed to the head section 6.</p> |
