发明名称 ELECTROLESS PLATING METHOD FOR EPOXY RESIN
摘要 PURPOSE:To permit direct application of a plating having adhesive power on an epoxy resin having high chemical resistance by using a chromic acid soln. contg. no sulfuric acid for etching in a plating method consisting of respective stages for preetching, etching, catalyzing and electroless plating. CONSTITUTION:The epoxy resin is preetched by an org. solvent. Said resin is etched by the chromic acid soln. contg. no sulfuric acid in the 2nd step. The chromic acid is thereby penetrated in the part swollen by the preetching and selectively dissolves said parts. Fine pores are formed on the resin surface at a high density by controlling the compsn. of the etching soln., temp. and time. For example, the etching is executed for 2-20min at 200-700g/l CrO3 concn. and 50-70 deg.C. The resin surface is thereafter metallized by subjecting the same to catalyzing and activating then to electroless plating by known methods.
申请公布号 JPS63206478(A) 申请公布日期 1988.08.25
申请号 JP19870037152 申请日期 1987.02.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJITA MINORU;KOBAYASHI MINORU
分类号 C23C18/22;C23C18/24 主分类号 C23C18/22
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