| 摘要 |
PURPOSE:To improve solder plating resistance by compounding an ester compd. obtd. from monohydric alcohol and (or) monovalent epoxy compd., cresol and phenol novolak type epoxy compd., and radical-polymerizable novolak type epoxy compd. having no epoxy groups except ester. CONSTITUTION:This compdsn. is compounded with 100pts.wt. mixture composed of the esterified compds. (A) obtd. by bringing the radical-polymerizable monohydric alcohol and (or) monovalent epoxy compd. and non-radical- polymerizable monohydric alcohol and (or) monovalent epoxy compd. at 0.05-0.95mol. ratio per mol. of a copolymerized maleic anhydride and itaconic anhydride component and one or >=two kinds of the epoxy compds. (B) selected from triglycidyl isocyanurate, cresol novolak type epoxy resin and phenol novolak type epoxy resin, etc., and 10-100pts.wt. radical-polymerizable compd. (C) having no epoxy groups except the above-mentioned (A). The solder plating resistance is thereby improved. |
