PRODUCTION OF CONDUCTOR PATTERN

摘要

PURPOSE:To form a conductor pattern having superior adhesive strength on a substrate by simultaneously subjecting the substrate to vacuum deposition and ion implantation. CONSTITUTION:A substrate coated with a metal mask is fitted to the target part of an ion implanting device provided with a vacuum depositing source. The vacuum deposition of a metal forming a conductor pattern and the ion implantation of accelerated inert gas ions are simultaneously carried out to form a pattern consisting of a mixture of conductor metal atoms and the constituent material of the substrate on the substrate. The formed conductor pattern has higher adhesive strength than a pattern formed by a conventional thick film process and can be soldered.