| 摘要 |
<p>An improved phased-array active antenna transmit-receive apparatus (1a, 1b) utilizing a multiplicity of individual transmit-receive cells (7) positioned in an array format upon a common wafer (17) of semiconductor material. Each transmit-receive cell (7) comprises a multiplicity of redundant, integrated circuit, electronic devices implanted upon the common semiconductor substrate (17). The transmit-receive cells (7) utilize novel mitered mechanical switches to permanently interconnect individual electronic devices into either transmit or receive circuits during the fabrication and test of the transmit-receive cells (7). Radio frequency and direct current input and output vias (57, 61, 62) formed from a novel metal evaporation technique connect the devices upon the surface of the common semiconductor wafer (17) to underlying, insulated direct current distribution circuits (66) and a radio frequency manifold (67). This array of improved phased-array active antenna transmit-receive apparatus (1a, 1b) comprised of transmit-receive cells (7) sharing common central processing unit (2), logic control (5) and heat dissipation apparatus (11) results in a significant reduction in the size and weight of the standard phased-array active antenna system.</p> |
