发明名称 |
MULTI-LAYER FLEXIBLE FILM MODULE |
摘要 |
A high density electronic circuit module which includes a thin flexible film chip carrier having circuitry on both sides thereof. The double-sided thin, flexible circuitry is fabricated by depositing a first layer of chrome-copper-chrome circuitry on an aluminum substrate. This first layer of chrome-copper-chrome circuitry is covered with a layer of polyimide. Vias are etched into the polyimide. Next, a second layer of chrome-copper-chrome circuitry is deposited on top of the polyimide. The first and second layers of circuitry are connected through the etched vias. Finally, hydrochloric acid is utilized to etch away the aluminum substrate carrier. It is noted that hydrochloric acid etches aluminum whereas it does not etch chrome-copper-chrome circuitry. |
申请公布号 |
DE3377440(D1) |
申请公布日期 |
1988.08.25 |
申请号 |
DE19833377440 |
申请日期 |
1983.11.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GAZDIK, CHARLES EDWARD;MCBRIDE, DONALD GENE |
分类号 |
H01L23/52;H01L21/48;H01L21/60;H01L23/14;H01L23/538;H05K1/00;H05K3/00;H05K3/20;H05K3/38;H05K3/46;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|