| 摘要 |
The invention relates to resin-molded axial lead-type semiconductor devices comprising a sub-assembly consisting of a semiconductor pellet (1) brazed between a pair of axial leads (5). The sub-assembly is sealed in an epoxy resin, which is formed by applying an epoxy resin, preferably a one-can-epoxy resin, onto the sub-assembly followed by curing the epoxy resin. Preferably, an epoxy resin having a thixotropic index of 1.0 to 2.5 and a gelation time 0.8 to 3 minutes is used. …<??>The invention further relates to a process for manufacturing these semiconductor devices which is characterised by:… (A) horizontally holding the sub-assembly and dropping a predetermined amount of an epoxy resin onto the semiconductor pellet while turning the sub-assembly with the axial leads as rotation axis,… (B) curing the epoxy resin, preferably by heating at 160 DEG to 180 DEG for a period of 2 to 10 min, while turning the sub-assembly, so that the surface portions of the epoxy resin are cured, and… (C) curing the epoxy resin, preferably by heating at 160 DEG to 200 DEG C for a period of 3 to 24 h while maintaining the sub-assembly stationary without turning it, so that the epoxy resin is completely hardened. |
