发明名称 HIGH-POWER MODULE
摘要 PURPOSE:To simplify the wiring side of a printed board, by setting the complicated wiring of a three-phase bridge circuit on the bridge wiring side, and by arranging external terminals properly. CONSTITUTION:The frame 3 of a module is manufactured by the punching method or the like of a metallic plate, and after transistor chips 1(Q1-Q6) are firmly fitted to the frame by soldering, the interconnections between the frame 3 and the chips 1 are provided by a compression bonding method or the like using thin aluminum wires. After that, molding with resin 4 is performed, and after that, by press-punching, external lead (external terminals) formation is performed, and suspension pins at a chip mounting section are separated from, and the external frame of the frame 3 is removed from, and a desired product is obtained. In this case, when the emitter of the transistor (Tr Q1) is connected to the collector of the Tr Q4, then jump connection with bonding wires 2 is performed on the side of the frame 3. Also between the Tr Q2 and Q5, between the Tr Q3 and Q6, connection is formed in the same manner. Then, the wiring side of a printed board can be simplified.
申请公布号 JPS63206166(A) 申请公布日期 1988.08.25
申请号 JP19870037781 申请日期 1987.02.23
申请人 TOSHIBA CORP 发明人 EMOTO TAKAO
分类号 H01L23/495;H01L25/07;H01L25/18;H02M7/00;H02M7/48;H02M7/5387 主分类号 H01L23/495
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