| 摘要 |
PURPOSE:To enhance the heat-dissipating performance and to reduce the ON resistance by a method wherein, after a circuit component has been mounted on a bed of a lead frame, it is fixed by laying a ceramic or the like between the bed and a heat sink so that this assembly can be resin-sealed. CONSTITUTION:A semiconductor device 3 is fixed to a bed part 2 of a lead frame 1. Then, an electrode which has been formed on the semiconductor device 3 is connected to an external lead of the lead frame by using a metal thin wire 5. Then, a heat sink 8 is provided an Ag paste 9 is coated on one face of the heat sink a ceramic plate 6 is mounted on the face so as to be united in addition, an adhesive 7 is coated on the ceramic plate 6 the bed part 2 where the semiconductor device 3 is fixed is bonded to the ceramic plate. Then, this assembly is put in a metal mold and is sealed by using a mold resin 10 in such a way that one plane face of the heat sink 8 is exposed. |
