发明名称 HIGH-SPEED PLATING DEVICE FOR CYLINDER
摘要 PURPOSE:To provide a high-speed plating device for a cylinder which smooths the flow of a plating liquid in the cylinder and improves the uniformity of a plating film by providing a supply port for the plating liquid thereto in the direction tangential to the cylindrical space formed between a cylindrical electrode projected upward from the device body and the inner peripheral face of the cylinder. CONSTITUTION:The engine cylinder 2 and the device body 3 are sealed by a sealing material 6 when the cylinder 2 is imposed on the body 3 and is pressed 21. A hermetic plating chamber 4 is, therefore, formed between the cylinder 2 and the body 3. A pump 29 is then driven to suck up the plating liquid from a plating liquid tank 26 and to forcibly feed the same into the supply port 25. Since this port 25 is opened in the tangential direction of the cylindrical space 14, the plating flow is admitted through the chamber 4 into the space 14 while said flow is kept whirling. The plating liquid is then run spirally upward along the inner peripheral face of the cylinder 2 from the lower side of the cylinder 2. The plating liquid is made to flow down on the cylindrical electrode 11 and is returned through a recovering tank 28 to the tank 28. Collision of the plating liquid against each other in the cylinder 2 is, therefore, prevented and the smooth flow of the plating liquid along the inner peripheral face of the cylinder 2 is permitted.
申请公布号 JPS63206496(A) 申请公布日期 1988.08.25
申请号 JP19870037818 申请日期 1987.02.23
申请人 YAMAHA MOTOR CO LTD 发明人 KONDO YUTAKA
分类号 C25D7/00;C25D5/08;C25D7/04 主分类号 C25D7/00
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