| 摘要 |
PURPOSE:To miniaturize the title recording head and to certainly connect the same to other circuit, by providing a step part on a substrate so as to surround an IC chip and sealing the region surrounded by said step part by a sealing material. CONSTITUTION:The terminal parts of an individual electrode 5, a signal electrode 7A and an electrode 7B for an earth circuit are opposed to the bonding pads 9a of the IC chip 9 on an insulating substrate 1 and bonded to said pads by wires 11 to be electrically connected thereto. The sealing material 2 sealing and protecting the IC chip 9, the wires 11 and the terminal parts of the electrodes 5, 7A, 7b in a thickness of about 1mm from the surface of the substrate within an annular region 13 so as to enclose the same is interrupted at the time of melting by the end surface of a protective layer 8. Therefore, the sealing material 12 is provided only to the annular region 13 and the inside region thereof to be prevented from flowing out to the protective layer 8 and, by selecting the material quality of the protective layer 8, the occupying area of the sealing material 12 is reduced by utilizing the inferiority in the wettability of the protective layer 8 and it is prevented that the sealing material is deposited to a terminal part 14 to bring about trouble in the connection of FPC. |
