| 摘要 |
PURPOSE:To prevent device reliability in terms of resistance to moisture from degrading after packaging by a method wherein a die pad is formed to be smaller than the bottom area of a semiconductor element. CONSTITUTION:Package cracks result from heat generated in a soldering process for installation on a surface when water vapor coming out of resin collects in an interface between a sealing resin and a die pad 4 and the die pad 4 consequently presses the sealing resin toward the bottom side for an eventual increase in volume. To counter the situation, the die pad 4 is designed to smaller than the bottom of a semiconductor element 3. This reduces the concentration of water vapor coming out of the sealing resin, which in turn prevents the generation of package cracks.
|
