| 摘要 |
<p>PURPOSE:To improve a solder packaging property by a method wherein the title semiconductor device is constituted in such a way that surfaces, on which sags generated by punching out a lead frame exist, are used as the sides of the packaging surfaces of the semiconductor device and surfaces, on which burrs exist, become the upper surface sides to become reverse to the packaging surfaces of the semiconductor device. CONSTITUTION:Packaging surfaces 13 of fixing parts 12 become surfaces, on which sags 2 generated by punching out a lead frame exist, and surfaces, on which burrs 4 are generated, become the upper surfaces to become reverse to the packaging surfaces 13. In case a molded minitransistor 10 is packaged, the packaging surfaces 13, on which the sags 2 exist, of the leads 1 are superposed on a solder cream 7 provided in a wiring layer 6 of a wiring board 5. After that, the solder cream 7 is fused by reflowing, is turned into a solder 9, the solder 9 mixes with solders 3 adhered on the leads 1 and the fused solder 9 in the lower direction is reliably sucked up to the leads 1 by the surface tension of the solders 3, in particular by the surface tension of the solders 3 including even the solders 3 on the sides of the flashes 4 of the leads 1. Thereby, the solder 9 (the solders 3) creeps over the whole periphery of each lead 1 and a good solder packaging can be conducted.</p> |
