| 摘要 |
PURPOSE:To form an aluminum interdigital electrode according to the design with high yield by imbedding a bonding pad and a bypass electrode into a substrate so as to smooth an aluminum interdigital electrode forming face. CONSTITUTION:Prior to the forming of a bypass electrode 9 and the bonding pad 8, a recessed part is provided to the position of the bypass electrode 9 and the bonding pad 8 on the surface of an LiTaO3 at a depth corresponding to the film thickness of the electrode 9 and the pad 8 and the bypass electrode and the bonding pad are formed. Thus, in the process of forming the aluminum interdigital electrode processed next to the bypass electrode 9 and the bonding pad 8 is precessed on a smooth and flat face. Thus, the exposure/baking of the photolithography in forming the aluminum interdigital electrode is adhered closely between an exposure mask and the substrate, and the aluminum interdigital electrode 10A with high accuracy and excellent edge linearity is obtained.
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