| 摘要 |
PURPOSE:To make it possible to perform a continuity test at a point a semiconductor chip is fixed on a tape base material by a method wherein the rear of the semiconductor chip is connected to a surface electrode through a metal cap bonded on the rear of the semiconductor chip and a rear potential connection lead. CONSTITUTION:A semiconductor chip 11 fixed on a tape base material 14 through a lead wiring by a tape carrier bonding system is positioned to a metal cap 15 from its rear side after a protrusion 15b is inserted in a tape base material notch 14c provided in the tape base material, is crowned thereon, and the inside bottom surface of the metal cap and the protrusion 15b are respectively bonded to the rear of the chip 11 and a connection lead 13. Moreover, a flange part 15a of the cap 15 is bonded to the base material 14 with a bonding agent or using a sealing resin 17. Thereby, it becomes possible to test after an inner lead-bonding.
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