| 摘要 |
PURPOSE:To make it possible to form a resin composition which can be easily molded and can give a molding free of microvoids while keeping the heat resistance of an aromatic polyimide resin as much as possible, by mixing a prepolymer obtained from a polymaleimide and a diamine with an aromatic polyimide resin and filler. CONSTITUTION:This molding composition is formed from a prepolymer (a) obtained by reacting a polymaleimide having at least two maleimide groups in the molecule with a diamine, an aromatic polyimide resin (b) of a degree of imidation iota85% and a powdery or fibrous filler (c). The mixing ratio is such that a:b=70:30-30:70 and (a+b):c=50:50 100:0. Mica is preferably as component (c) because of its good compatibility with the resin component.
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