Enhanced plasma etching.,申请号EP19880100676-传众专利搜索

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发明名称	Enhanced plasma etching.
摘要	<p>Increased etching rates are obtained by plasma etching wherein the power is applied in a cyclical or oscillating mode.</p>
申请公布号	EP0279188(A2)	申请公布日期	1988.08.24
申请号	EP19880100676	申请日期	1988.01.19
申请人	INTERNATIONAL BUSINESS MACHINES CORPORATION	发明人	EGITTO, FRANK DANIEL;MLYNKO, WALTER EUGENE
分类号	H01L21/302;H01L21/3065;H01L21/311;H05K3/00;(IPC1-7):H01L21/31	主分类号	H01L21/302
代理机构		代理人
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