IMPROVEMENTS IN DIAMOND HEATSINK ASSEMBLIES

摘要

A diamond heatsink assembly for small electronic components such as microwave or millimetric wave devices comprises a frusto-conical shaped diamond held on a supporty by a clamping member with a part-conical hole through it. One or both of the support and the clamping member are made of a high thermal conductivity metal such as gold, silver, copper or aluminium. The clamping member may be secured to the support by soldering friction welding, a screw thread or any other suitably tight clamping method. The diamond, the support and the clamping member may be metallised to reduce electrical skin resistance. The arrangement is an improvement on diamond heatsinks in which a diamond is simply bonded to the support by soldering or brazing and heatsinks in which the diamond is pressed into the surface of the support.