| 摘要 |
PURPOSE:To obtain a resin composition which is excellent in adhesion, heat resistance, electrical properties, etc. and can give a low-dielectric constant molding, by mixing an N-substituted maleimide compound with a 2-silyl-2,4- butadiene (derivative). CONSTITUTION:A compound (A) having at least one N-substituted maleimide group (e.g., N,N'-ethylenebismaleimide) is mixed with a 2-silyl-1,3-butadiene (derivative) (B) of the formula (wherein X is a halogen or an alkoxy), e.g., 2-trimethoxysilyl-1,3-butadiene, to obtain the purpose heat-resistant composition. This resin composition is excellent in adhesion to inorganic substances and metals as structural components of electronic components, etc. The flow during molding can be further improved by adding a compound having at least one o-allylphenol nucleus (e.g., diallyl bisphenol A).
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