| 摘要 |
PURPOSE:To contrive to be able to utilize effectively the heat source being already provided in a wire bonder by performing an after-cure by the wire bonder. CONSTITUTION:A lead frame 4 mounted with semiconductor integrated circuit elements 3 is placed on a heater block 5, the lead frame 4 is heated by the heater block 5 while the lead frame 4 is given a feed to the right from the left in every bonding on the heater block 5 and a wire-bonding is performed between the circuit elements 3 and the lead frame 4 using a wire 2 passed through a capilary 1. In this case, the lead frame 4 is heated by the heater block 5 using the heater block 5 for wire-bonding as a heat source as being mounted on the heater block 5 after the wire-bonding or in succession to the wire-bonding and an after-cure is performed.
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