| 摘要 |
PURPOSE:To produce a sealing resin high in reliability because of less stress within and excellent in resistance to moisture by a method wherein an epoxy resin composition containing specified components is used for the sealing of a semiconductor element. CONSTITUTION:An epoxy resin composition containing silicone rubber particles is used to seal a semiconductor element. A silicone rubber particle used in this design incorporates an epoxy resin, a phenol resin, and one or more selected from a line-up of an epoxy group, amino group, hydroxyl group, and carboxyl group. When one or more selected from the line-up of an epoxy group, amino group, hydroxyl group, and carboxyl group are added to the silicone rubber particle, denaturation takes place, which reduces stress present in a seal ing resin and improves a resin-sealed semiconductor element in terms of its resistance to moisture.
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