发明名称 |
Method of making a flexible base plate for printed circuit board |
摘要 |
The invention provides a method for the preparation of a flexible base for printed circuit board of the type formed of lamination of a flexible sheet-like polymeric base and a metal, e.g. copper, foil adhesively bonded to the surface thereof by use of an adhesive, in which the surface of the polymeric base prior to bonding of the metal foil is subjected to exposure to low temperature plasma so that the adhesive bonding strength between the polymeric base and the metal foil can be greatly improved.
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申请公布号 |
US4765860(A) |
申请公布日期 |
1988.08.23 |
申请号 |
US19870115659 |
申请日期 |
1987.10.27 |
申请人 |
UENO, SUSUMU;KITAMURA, HAJIME;INOUE, KANAME |
发明人 |
UENO, SUSUMU;KITAMURA, HAJIME;INOUE, KANAME |
分类号 |
B32B15/08;C08J5/18;H05K1/00;H05K3/38;(IPC1-7):B05D3/06;B32B31/28 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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