| 摘要 |
A test device for burn-in tests of semiconductor packages. The device includes a printed circuit board provided with openings or frames for receiving the semiconductor packages to be tested and aligning the package lead with circuit board terminals. A cover plate provided with elastic bodies on a back side thereof is used to concurrently elastically press all of the leads and terminals into electrical contact. In one embodiment, elastic connectors having thin metal wires embedded therein are provided in the openings or frames to electrically connect the leads to the terminals when the cover plates is pressed downwards on the semiconductor packages.
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