发明名称 AUTOMATIC SOLDERING DEVICE FOR CIRCUIT BOARD
摘要 PURPOSE:To effect soldering with high accuracy by using a laser light after performing the position correction by the signal from the CCD camera arranged at the upper part of a lead as well as preheating a board by the projecting light from the light source provided at the lower part of a moving base. CONSTITUTION:The light emitted from a light source 8 is projected on a circuit board 3 via a lens 9. The transmission light emitted from the part between pads 4 is observed by a CCD camera 14 and a controller 15 is actuated based on the signal from the camera 14 to correct the dislocation of a pad from the lead 6 located by a pin 7 by driving a motor 2. Thereafter, soldering is effected by projecting a laser light. With the device of this composition, the quality and efficiency are improved.
申请公布号 JPS63203269(A) 申请公布日期 1988.08.23
申请号 JP19870035593 申请日期 1987.02.20
申请人 NEC CORP 发明人 MIURA HIROSHI
分类号 B23K3/00;B23K1/005;B23K3/04;B23K26/00;B23K26/20;H05K3/34 主分类号 B23K3/00
代理机构 代理人
主权项
地址