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发明名称
METHOD OF PACKAGING LEAD FRAME FOR CONNECTING SEMICONDUCTOR ELEMENT
摘要
申请公布号
JPS63203573(A)
申请公布日期
1988.08.23
申请号
JP19870032023
申请日期
1987.02.13
申请人
MITSUBISHI ELECTRIC CORP
发明人
OKAMOTO AKIHIRO
分类号
B65D77/02
主分类号
B65D77/02
代理机构
代理人
主权项
地址
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