| 摘要 |
PURPOSE:To improve impedance stability by electrically connecting one parts of first metallic electrodes and one parts of second metallic electrodes for a plurality of impedance conversion circuits to an input pad or an output pad and a grounding pad for a semiconductor chip under the state in which one parts of the first metallic electrodes and one parts of the second metallic electrodes are protruded from a heat-resistant flexible film in predetermined length. CONSTITUTION:One parts of first metallic electrodes 4, 5 and one parts of second metallic electrodes 2 formed onto both surfaces of a heat-resistant flexible film 1 are connected electrically to pads for a semiconductor chip 6 under the state in which they are protruded from the heat-resistant flexible film 1 in prescribed length. Consequently, bonding wires having instable elements need not be used, and the impedance characteristics of high frequency are not changed. The second metallic electrodes 2 shaped onto approximately the whole surface of the reverse main surface side of the heat-resistant flexible film 1 are connected electrically to grounding pads for the semiconductor chip 6 at the shortest distances, thus minimally inhibiting a feedback element, then also reducing the lowering of the gains of a transistor. |
