| 摘要 |
PURPOSE:To find the occurrence of cracks in a semiconductor chip beforehand, by providing elements for detecting stress. CONSTITUTION:For example, slender piezoelectric elements 3 having a rectangular shape are provided at the sides of semiconductor chip 1 in parallel on a passivation film at the peripheral part of the semiconductor chip 1. When the piezoelectric element 3 is provided at the peripheral part of the semiconductor chip 1, the stress at the peripheral part, where the largest stress tends to yield, can be detected with good sensitivity based on a voltage across both ends. Both ends of the piezoelectric element 3 are connected to the protruding parts of bonding pads 21 and 22 for the piezoelectric element 3 through opening parts, which are provided in the passivation film (not shown in the Figure). Thus the stress in the semiconductor chip 1 can be detected based on the electric output (voltage) of the piezoelectric element 3. In this way the occurrence of cracks in the semiconductor chip 1 can be found at an early stage.
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