| 摘要 |
PURPOSE:To obtain the titled molding material with no mold stain occurring, capable of enhancing continuous moldability, suitable for semiconductor sealing, by incorporating a specific silicone compound in an epoxy resin composition. CONSTITUTION:The objective molding material can be obtained by incorporating (A) an epoxy resin (e.g., bisphenol A type one) composition with (B) pref. 0.05-5wt.% of a silicone compound of formula (X is functional group; n and m are each 1-500) (pref., silicone-modified epoxy glycol).
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