发明名称 AMPLIFIER MODULE
摘要 PURPOSE:To prevent leakage of high frequency from a bias terminal by arranging a circuit board near a bias terminal at the outside of a metallic airtight package containing a dielectric base and a transistor chip or the like and connecting the bias terminal to the bias supply source via a choke circuit provided to the circuit board. CONSTITUTION:The vicinity of bias terminals 10-13 of the metallic airtight package 1 in which dielectric bases 4-6 forming a matching circuit, transistor chips 7, 8 and a chip capacitor 9 or the like are contained is prolonged and a mount base 24 is provided and a circuit board 25 comprising an integrated circuit board or a printed circuit board is arranged to the mount base 24. Then a part of conductive film is subjected to patterning into a required length to constitute a tip short-circuit choke circuit 26 on the circuit board 25 and the choke circuit 26 is connected to the bias terminal 10. Thus, the high frequency in the metallic airtight package 1 is cut off by the choke circuit 26 and the leakage of high frequency through the bias terminal is prevented.
申请公布号 JPS63200604(A) 申请公布日期 1988.08.18
申请号 JP19870031435 申请日期 1987.02.16
申请人 NEC CORP 发明人 KOMIYA KAZUO
分类号 H03F1/00;H03F3/189;H03F3/60 主分类号 H03F1/00
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