| 摘要 |
PURPOSE:To provide two rows of electrode terminals in one lead-out side of an integrated circuit package and improve the mounting density of a printed wiring board and reduce the cost by a method wherein the circumference for lead-out of the electrode terminals of the integrated circuit package main part is formed into a zigzag shape and the electrode terminals are provided at its protruding parts and recessed parts. CONSTITUTION:Protruding parts and recessed parts are alternately provided along the four circumferential sides of an integrated circuit package main part and protruding part electrode terminals 2 or 4 are provided at the protruding parts and recessed part electrode terminals 3 or 5 are provided at the recessed parts respectively. By providing a sufficient distance between the tip of the protruding part and the bottom of the recessed part in the main part 1 and making the spacing between the electrode terminals 2 and 3 as small as possible, the mounting density of the electrode terminals 2 and 3 can be improved without enlarging the main part 1. Moreover, the electrode terminals 4 provided at the protruding parts are bent outward so as to protrude and the electrode terminals 5 provided at the recessed parts are bent inward to extend the mounting surface area of the main part 1.
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