| 摘要 |
PURPOSE:To prevent a lead frame from rising off the surface of a semiconductor device and facilitate assembly work of the semiconductor device by selecting the thickness of the lead frame material so as to make the depth of a necessary recess less than 60% of the thickness. CONSTITUTION:A lead frame unit for a semiconductor device is composed of a semiconductor element mounting part 1, a plurality of inner lead parts 2 and a plurality of outer lead parts 3 and the lead frame units are repeatedly formed in one plane to constitute a lead frame. A recess 4 with a depth of 0.3 mm is formed in the element mounting part 1 and the lead frame is covered with sealing resin 6 composed of Fe-Ni with a thickness of 0.5 mm. A light emitting diode is employed as the semiconductor element 7 placed and bonded in the recess 4 with conductive paste. The recess 4 is formed by a stamping process to reduce the influence upon the other parts, prevent the lead frame from rising off the surface of the semiconductor device and facilitate assembly of the device. |
