发明名称 MANUFACTURE OF CERAMIC-COATED COPPER FOIL
摘要 PURPOSE:To manufacture a ceramic-coated copper foil excellent in adhesive strength and free from pores, by allowing fine copper grains to adhere to the rough-surface side of an electrolytic copper foil by means of electrodepoposition to form an irregular surface and by successively forming a ceramic thermally sprayed layer and a ceramic coating layer on the above irregular surface. CONSTITUTION:A fine-grain layer 2 of copper or copper oxide or mixture thereof is allowed to adhere to the rough-surface side of an electrolytic copper foil 1 by means of electrodeposition to form a fine irregular surface. Then, ceramic (alumina is preferred) is thermally sprayed on the above irregular surface of the fine-grain layer 2 so as to be formed into a ceramic thermally sprayed layer 3. Further, a ceramic coating (alumina and silica are preferred) is applied to this ceramic thermally sprayed layer 3 and then dried and solidified at room temp. or at about 100-200 deg.C so as to be formed into a ceramic coating layer 4. In this way, the ceramic-coated copper foil excellent in adhesive strength between the ceramic thermally sprayed layer 3 and the copper foil 1 and free from pores can be obtained.
申请公布号 JPS63199856(A) 申请公布日期 1988.08.18
申请号 JP19870033096 申请日期 1987.02.16
申请人 HITACHI CHEM CO LTD 发明人 HASEGAWA HIROSHI;INOUE MITSUHIRO
分类号 C23C4/00;C23C2/02;C23C4/18;H05K3/38 主分类号 C23C4/00
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