| 发明名称 |
Circuit arrangement containing one or more integrated circuits |
| 摘要 |
A vacuum-tight encapsulation is proposed for ICs on a ceramic substrate having conductor tracks, in particular for IR detectors. The encapsulation comprises a metal cap attached in an insulating manner by means of a glass solder.
|
| 申请公布号 |
DE3703280(A1) |
申请公布日期 |
1988.08.18 |
| 申请号 |
DE19873703280 |
申请日期 |
1987.02.04 |
| 申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
KLAUS,WOLFGANG;LOBENSTEIN,WALTER;THEISS,JOSEPH |
| 分类号 |
H01L23/04;H01L23/10;(IPC1-7):H01L23/02;H01L23/06;H01L23/50;H01L27/14;G01J1/02;G01D5/40 |
主分类号 |
H01L23/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
