发明名称 INTEGRATED CIRCUIT PACKAGE
摘要 PURPOSE:To condense a light and erase a record in a short time by a method wherein an optical waveguide such as a graded index optical fiber is provided in an EPROM package and a light from the outside is applied to the surface of an IC pellet in the package through the optical waveguide. CONSTITUTION:The optical fiber 1 in a molded package 5 in which an IC pellet 6 is contained is fixed with transparent adhesive 2 and molded with molding resin together with bonding wires 3 and a lead frame 4. The optical fiber 1 is sintered with a ceramic cover 7 and a light is guided onto the irradiated position of the IC pellet 6 fixed to the recessed part of a ceramic package substrate 8 to erase the record in the pellet 6 by the light from the side. Or a selfoc lens 10 is buried in the ceramic cover 7 and a light is condensed by the lens 10 and applied to a part of the pellet 6. Then the light outside the package is condensed by the optical waveguide and the record in the pellet 6 is erased in a short time.
申请公布号 JPS63200547(A) 申请公布日期 1988.08.18
申请号 JP19870033951 申请日期 1987.02.16
申请人 NEC CORP 发明人 TOMOSUGI TAMIO
分类号 H01L21/8247;G02B6/42;H01L23/02;H01L23/28;H01L29/788;H01L29/792 主分类号 H01L21/8247
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