| 摘要 |
<p>PURPOSE:To avoid creation of crackings of a wafer surface and silicon powder by breaking the wafer while a tension is applied by expanding the circumference of an extension sheet on which the semiconductor wafer is bonded. CONSTITUTION:An extension sheet 2 on which a wafer 5 is bonded after dicing is placed on a breaking table 6. When a sheet expanding cylinder 4 is driven, the extension sheet 2 is pushed down by upper and lower clampers 7 and 8 and a tension is applied to the sheet 2. Under these conditions, a roller 1 pressurized by a roller pressurizing cylinder 3 is rolled to X and Y directions on the surface of the wafer 5 to break the wafer.</p> |
