发明名称 PHENOXY RESIN COMPOSITION
摘要 PURPOSE:To provide a phenoxy resin composition composed of a phenoxy resin and an aromatic polyamide and giving a molded article having high mechanical strength such as elastic modulus, breaking strength, etc., and excellent chemical resistance, abrasion resistance, etc. CONSTITUTION:The objective composition is composed of (A) 99.8-70pts.wt. of a phenoxy resin which is a polycondensation product of epichlorohydrin and bisphenol A (or its nucleus-substituted compound) and consisting of the structural unit of formula (n is positive integer of preferably >=70) and (B) 0.2-30pts.wt. of an aromatic polyamide, preferably poly(p-phenylene terephthalamide) or poly(p-benzamide) having a molecular weight of >=1,000, especially >=7,000. The components A and B are uniformly dissolved in a common solvent (e.g. dimethylacetamide) containing e.g. lithium chloride and the solution is poured into a poor solvent, dispersed and coagulated to obtain particles of the component B containing uniformly dispersed component A.
申请公布号 JPS63199260(A) 申请公布日期 1988.08.17
申请号 JP19870031732 申请日期 1987.02.13
申请人 SEKISUI CHEM CO LTD 发明人 FUKAI TOMOHIRO;KAMISAKA TOSHIO;NAKAMURA HIRONOBU
分类号 C08L71/00;C08L71/08;C08L77/10 主分类号 C08L71/00
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