发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To reduce the number of operating steps for a pellet selection process by a method wherein a covering photoresist at a detective device is removed during a device separation process by etching. CONSTITUTION:Before a device separation process is executed by an etching method, the external appearance of the surface of a device is checked through a glass plate 3; only a covering photoresist 4 at a part corresponding to a device with a bad mark marked during a checking operation of the characteristic for all devices after formation of a surface electrode or at the part corresponding to the device with the defective external appearance is exposed to light by using a photo mask 7. Accordingly, the covering photoresist 4 at a defective device part 5 can be removed by a developing process. Then, if this assembly is etched by making use of the covering photoresist 4 as a mask and the device separation process is executed, a defective pellet can be removed simultaneously. By this setup, when pellets are taken apart after they have been detached from the glass plate or the like used during a production process and have been cleaned, it does not occur that the pellets are mixed with defective pellets; as a result, the number of operating steps for a pellet selection process can be reduced sharply.</p>
申请公布号 JPS63198370(A) 申请公布日期 1988.08.17
申请号 JP19870031007 申请日期 1987.02.13
申请人 NEC CORP 发明人 NAKAJIMA MASAHIDE
分类号 H01L21/301;H01L21/306;H01L21/338;H01L21/76;H01L21/78;H01L27/12;H01L29/80;H01L29/812 主分类号 H01L21/301
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