| 摘要 |
PURPOSE:To obtain the titled composition suitable as a molding material, etc., having excellent workability and toughness, improved curing properties and high glass transition temperature, by blending a specific low-melting bismaleimide resin with resol type phenolic resin. CONSTITUTION:(A) 100pts.wt. bismaleimide resin which consists of 9-60wt.% bismaleimide and 3-40wt.% prepolymer obtained by reaction of bismaleimide, having 500-5,000 molecular weight, and has 70-100 deg.C low melting point is blended with (B) 5-200pts.wt. resol type phenolic resin having 50-120 deg.C melting point to give the aimed composition. The computer A is preferably obtained by dissolving 5-30wt.% bismaleimide under heating at 160-200 deg.C bath temperature, gradually adding the rest of the bismaleimide while keeping suspension state with stirring and carrying out the reaction until the reaction system becomes transparent.
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