发明名称 EPOXY RESIN COMPOSITION SEALING SEMICONDUCTOR
摘要 PURPOSE:To obtain thee titled composition having excellent water-vapor resistance, improved moldability and appearance of molded article, by blending a specific epoxy resin with a curing agent, an inorganic filler and a rubber-like resin. CONSTITUTION:(A) An epoxy resin shown by the formula (n is 0-2) is uniformly blended with (B) a curing agent for an epoxy resin (e.g. phenolic novolak resin, etc.), (C) an inorganic filler (e.g. silica powder, antimony oxide, etc.) and (D) a rubber-like resin (e.g. natural rubber, synthetic rubber, etc.) to give the aimed composition. The blending ratio of the components is preferably 1-100pts.wt. curing agent B and 5-30pts.wt. rubber component D based on 100pts.wt. resin A And 60-85wt.% filler C based on sum of the composition. The composition may be optionally mixed with a curing promoter, a flame-retardant, an internal mold release agent, a coupling agent, pigment, etc.
申请公布号 JPS63199218(A) 申请公布日期 1988.08.17
申请号 JP19870029814 申请日期 1987.02.13
申请人 ASAHI CHEM IND CO LTD 发明人 YOKOTA MASAHISA
分类号 C08G59/24;C08G59/20;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/24
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