| 摘要 |
PURPOSE:To obtain the titled composition, containing an epoxy resin, specific silicone-modified phenolic resin, curing catalyst and inorganic filler, having a low viscosity, capable of exhibiting good fluidity and providing cured articles having excellent mechanical properties, water absorption ratio, volume resistivity as well as moisture resistance. CONSTITUTION:The aimed composition, obtained by containing (A) an epoxy resin having >=2 epoxy groups in one molecule (preferably with <=500ppm hydrolyzable halogen content) with (B) a silicone-modified resin having >=2 phenolic hydroxyl groups in one molecule and <=60 deg.C softening point as a curing agent (e.g. a compound expressed by the formula, etc.), (C) a curing catalyst (e.g. imidazole, etc.) in an amount of 0-10pts.wt. based on 100pts.wt. total of the components (A) and (B) and (D) an inorganic filler (e.g. crystalline silica, etc.) in an amount of 0-500pts.wt., preferably <=250pts.wt. based on 100pts.wt. total of the components (A) and (B) and having <=1,000 P viscosity at 25 deg.C of the blend of the components (A) with (B).
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