发明名称 JET SOLDER TANK
摘要 PURPOSE:To thin the thickness of the jet wave of a solder molten liquid, to quicken a jet speed and to adjust the angle of the jet wave by providing rotatably the cylindrical jet body having a slit-like through hole blowing out the jet wave of the solder molten liquid in the opposite direction to the running direction of a printed circuit board. CONSTITUTION:The solder molten liquid 13 pressurized by being fed into a jet tank 14 comes between a jet body 20 and inner cylinder 225 via the inflow port 21 of the jet body 20, whose longitudinal direction is at right angle with the running direction A of a printed circuit board 1 and provided freely rotatably, is blown out with the climbing angle of an angle theta2 from a through hole 22 and blown to the printed circuit board 1 to perform the soldering of a chip part 2. For changing the jet angle theta2 of a jet wave 13a, a screw 28 is loosened and fixed after rotating the jet body 20 to a fixed position in the inner peripheral direction. Since the through hole 22 of the jet body 20 is formed in an oblong hole shape with harrow width the blowing out jet wave is thin in its thickness and the speed at the time of jetting is fast, so a complete soldering can be effected.
申请公布号 JPS63199064(A) 申请公布日期 1988.08.17
申请号 JP19870028083 申请日期 1987.02.12
申请人 KONDO KENJI 发明人 KONDO KENJI
分类号 B23K1/08;B23K3/06;B23K101/42;H05K3/34 主分类号 B23K1/08
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